Merkukhin E.N. 1
Omarov O.M. 1
1 Dagestan State Technical University” of the Ministry of Education and Science of the Russian Federation
In article the model for calculation of a temperature field of payments of microblocks of the electronic equipment and an assessment of its adequacy is offered. The model is constructed on the basis of reasonable assumptions and is hierarchical. At first case temperature decides on use of known engineering methods of calculation, and then the temperature field of each payment a numerical method of the top relaxations pays off. The offered computing formula allows to carry out calculations for areas with non-uniform teplofizi-chesky characteristics. Further the electrothermal analogy for calculation of temperature of each electronic element is used. For an assessment of adequacy of model computing and physical experiments are made. When carrying out computing experiments reaction of model to change of entrance data is investigated: coordinates of a source of heat on a payment, thickness of the heat-conducting core of a payment and a dielectric covering, coefficients of heat conductivity of materials of a payment, the power disseminated by a source of heat, thickness of heat-conducting paste between a source of heat and a surface of a dielectric covering of the core of a payment. On reaction of model the conclusion about its adequacy and possibility of use for heatphysical calculations of microblocks of the electronic equipment is made.